RESIN SEALED TYPE SEMICONDUCTOR DEVICE

摘要

PURPOSE:To relieve any stress inside a chip by a method wherein a substrate provided with the thermal expansion coefficient similar to the rigidity equivalent or higher as well as the surface space narrower in comparison with those of a semiconductor chip is bonded to the main surface of semiconductor chip to seal the semiconductor chip with resin. CONSTITUTION:A ceramic sheet e.g. 100-500mum thick is used for a material substrate 10 while soft resin such as silicon etc. is used for a bonding agent 11. The ceramic sheet is provided with the thermal expansion coefficient almost equal to that of silicon and less than that of sealing plastic as well as the rigidity almost equal to that of crystal silicon. The size and shape of material substrate 10 shall be made enough to cover the overall surface of a chip excluding the bonding pad region e.g. 4.5-5mm square for the chip size of 6mm square may be appropriate. Through these procedures, any stress inside the chip may be relieved remarkably hardly subjecting to any abnormality on the chip surface.