| 摘要 |
PURPOSE:To ensure the comparatively small reduction of the Q value and also to attain a shielding process with extremely small thickness, by using an insulated substrate bonded with a metallic foil having small resistance loss as a shielding material and therefore keeping both the inductance value and the Q value of a print coil. CONSTITUTION:A shielding member containing an insulated substrate 3 and a metallic foil 4 is attached close to the surface of a print coil 2 formed on a printed board 1 with an adhesive. Thus the distance between the coil 2 and a shielding metallic foil is controlled and kept at a fixed level. Then both the inductance value and the Q value of the coil 2 are kept at fixed levels. Here the shielding metallic foil uses the copper, a copper alloy, etc. having small resistance loss. Therefore the coil 2 has small energy loss and the reduction of the Q value of the coil 2 is kept at a comparatively small level. At the same time, the shielding height can be reduced extremely.
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