发明名称 METAL PLATED AMORPHOUS ALLOY
摘要 PURPOSE:To manufacture an amorphous alloy-base composite material having high solderability and workability by plating an amorphous alloy with a metal after chemical polishing and electrolytic activation. CONSTITUTION:An amorphous alloy is chemically polished by immersion or electrolysis in an acidic activating bath contg. hydrochloric acid, sulfuric acid, citric acid, acetic acid or nitric acid, a nonionic or amphoteric surfactant and N-alkyltrimethylenediamine. The surface of the polished alloy is activated by electrolytic activation in a cathodic electrolytic bath contg. phosphoric acid, sulfuric acid, citric acid or acetic acid, a nonionic or amphoteric surfactant and an amine-base corrosion inhibitor. By the activation, a passive film on the surface of the alloy is removed, and a monomolecular layer which prevents the penetration of hydrogen atoms is rapidly formed on the surface of the alloy. The amorphous alloy is then subjected to electroplating and/or electroless plating to form a plated layer having superior adhesion without causing hydrogen embrittlement.
申请公布号 JPS61166986(A) 申请公布日期 1986.07.28
申请号 JP19850004932 申请日期 1985.01.17
申请人 KOBAYASHI MASAMI 发明人 KOBAYASHI MASAMI
分类号 C23C2/02;C23C18/16;C23C18/31;C23C18/34;C23C18/40;C23C28/02;C23C30/00;C23F3/06;C23G1/02;C25D5/24;C25F1/06 主分类号 C23C2/02
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