| 摘要 |
PURPOSE:To contrive miniaturization and cost reduction by a method wherein a metal plate is fixed to the inner surface of a chip, and the outer surface of the metal plate is provided with a heat dissipator having a plurality of fins. CONSTITUTION:An Al film is formed at the wire-installing part of the tip of each lead 8 of a thin plate lead frame 15 made of kovar or the like having a coefficient of thermal expansion approximate to that of Si. A supporting plate 4 where a heat sink 14 having a heat dissipating fins 21 has been fixed is secured to the second casing 3 via reinforcing plate 6. A pellet 11 is fixed to the supporting plate 4. The electrodes of the pellet are electrically connected to the leads with wires 13. The first casing 1 is put over the second casing 3 and hermetically sealed in an integral body. The surfaces of the leads 8 projecting out of the package section 10 are plated with solder. Only the leads 8 are cut off at the joint of a rim 16. Screening and classification are done by characteristic measurement of each package. The leads are bent and molded in the products judged as non-defective as the result of measurement. The rim sections are broken off from the recesses 19 of dummy leads 18, and an LSI package is obtained. |
