| 摘要 |
PURPOSE:To provide a heat chip for thermocompression bonding with which the sticking and seizure of a conductive adhesive material arise hardly and which permits repetitive thermocompression bonding operations by subjecting at least one surface of the heat chip which contacts with the object to be thermocompression-bonded to a 'Teflon(R)' coating. CONSTITUTION:In the figure 8, denotes a printed circuit board, 9 a part to be thermocompression-bonded to the circuit board 8, 10 a stage for the circuit board 8, 11 the heat chip for thermocompression bonding and 12 the holder of the heat chip 11. 15 Is a cylinder to operate vertically the heat chip 11. The circuit board 8 and the part 9 are set to the stage 10 and thereafter the electrically heated chip 11 is pressed by the cylinder 15 thereto by which the circuit board 8 and the part 9 are thermocompression-bonded in the above- mentioned constitution. At least one surface of the chip 11 which contacts with the part 9 is subjected to the 'Teflon(R)' coating and therefore the sticking and seizure of the conductive adhesive agent (solder, etc.) arise hardly and the uniform thermocompression bonding is made possible. |
