| 摘要 |
PURPOSE:To prepare a highly heat conductive and insulating organic adhesive, by adding powdered diamond to a macromolecular material so that the cured material may have a specified heat conductivity. CONSTITUTION:Diamond in powder is added to amacromolecular material as filler so that the cured material may have a heat conductivity of 3X10<-3>cal/ cm.sec. deg.C or higher. The diamond may be natural or synthetic and should pref. have a lowest possible impurity content. Since heat conductivity is de creased with an increase in the nitrogen content, it also should pref. have a nitrogen content of less than 500ppm and in this case, it has a heat conductivity of 3.1cal/cm. deg.C, A preferred particle size of diamond as filler is 0.1-100mu.
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