发明名称 PRODUCTION OF COLLOIDAL COPPER CATALYST SOLUTION FOR ELECTROLESS PLATING
摘要 PURPOSE:To produce a colloidal copper catalyst soln. suitable for use in the electroless plating of an electric insulator by preparing an aqueous soln. contg. Cu ions, gelatin, polyethylene glycol and dimethylaminoborane under specified conditions and by subjecting the soln. to reduction, aging and pH adjustment under specified conditions. CONSTITUTION:An aqueous soln. contg. bivalent Cu ions in the form of copper sulfate or the like gelatin by >=0.8g per 1g bivalent Cu ions and polyethylene glycol having 1,000-100,000 average mol.wt. by >=0.8g per 1g bivalent Cu ions is adjusted to 1-2pH with sulfuric acid or potassium hydroxide. Dimethylaminoborane is added to the aqueous soln. by >=1.2g per 1g bivalent Cu ions. The resulting soln. is heated to 40-70 deg.C to reduce the Cu ions to metallic Cu, and it is further heated to >=70 deg.C, aged for a desired time, and adjusted to 2-4pH. Thus, a catalyst soln. for perfect electro-less plating is obtd.
申请公布号 JPS61139672(A) 申请公布日期 1986.06.26
申请号 JP19840261277 申请日期 1984.12.11
申请人 NEC CORP 发明人 KOBAYASHI KENJI
分类号 C23C18/30;B01J31/00;C23C18/28 主分类号 C23C18/30
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