发明名称 FORMING METHOD FOR LEAD FRAME PATTERN BY ETCHING
摘要 PURPOSE:To reduce the using amount of etchant by contacting etchant only with a boundary between an opened metal foil portion and the remaining portion. CONSTITUTION:A copper thick plate 1 is prepared, and a boundary between a portion 2 opened by etching and the remaining portion, i.e., the pattern portion 3 is slightly allowed to remain, and the entire surface of the other portion 4 is resist printed. The width of the portion not coated with resist ink is slightly 0.2mm, and only this portion is contacted with an etchant reagent. The chip of the opening portion finished for etching is dripped by the propagation of vibration energy from a supersonic vibrator 6.
申请公布号 JPS61131473(A) 申请公布日期 1986.06.19
申请号 JP19840252667 申请日期 1984.11.29
申请人 HITACHI CABLE LTD 发明人 ONDA MAMORU
分类号 H01L23/50;C23F1/00;H01L21/48 主分类号 H01L23/50
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