| 摘要 |
PURPOSE:To ensure airtight sealing, to improve sealing strength and to improve the reliability of a semiconductor device, by performing glazing of low melting point glass on the surface of at least one sealing part of a pellet attaching substrate or cap after the finish of fablication, heating both parts to a specified temperature, and sealing a package. CONSTITUTION:In a glazing process 1, low melting point glass is deposited on the sealing surface of a pellet attaching substrate. In a heating process 2, the device is heated to a specified temperature. With respect to a cap, the similar glazing process 1a and the similar heating process 2a are performed in parallel. Thereafter, the sealing parts of both parts are laminated and bonded in a sealing process 3. After a cooling process 4, a package is sealed. The sealing is performed after the pellet attaching substrate and the cap are heated to a specified temperature beforehand. Therefore, the effect of the expansion of air in the cavity can be avoided. Thus yield of voids in the low melting point glass at the sealing parts can be prevented. |
