发明名称 |
Composite support for semiconductive units or electrical components |
摘要 |
The support for an electrical component consists of a carbon substrate coated with a first bonding layer of silicon carbide or nitride, and a second, electrically insulating layer of amorphous alumina whose breakdown voltage is higher than 200 V per micron of thickness. This support has a thermal conductivity higher than 70 W/m DEG C, and an electrical resistivity higher than 10<9> ohm cm.
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申请公布号 |
CH656022(A5) |
申请公布日期 |
1986.05.30 |
申请号 |
CH19840000778 |
申请日期 |
1984.02.17 |
申请人 |
BATTELLE MEMORIAL INSTITUTE |
发明人 |
DE POUS, OLIVIER;SCHACHNER, HERBERT;TIPPMANN, HEINZ |
分类号 |
H01L23/15;H01L23/373;H05K1/05;(IPC1-7):H01L23/14;H01L23/36 |
主分类号 |
H01L23/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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