发明名称 Composite support for semiconductive units or electrical components
摘要 The support for an electrical component consists of a carbon substrate coated with a first bonding layer of silicon carbide or nitride, and a second, electrically insulating layer of amorphous alumina whose breakdown voltage is higher than 200 V per micron of thickness. This support has a thermal conductivity higher than 70 W/m DEG C, and an electrical resistivity higher than 10<9> ohm cm.
申请公布号 CH656022(A5) 申请公布日期 1986.05.30
申请号 CH19840000778 申请日期 1984.02.17
申请人 BATTELLE MEMORIAL INSTITUTE 发明人 DE POUS, OLIVIER;SCHACHNER, HERBERT;TIPPMANN, HEINZ
分类号 H01L23/15;H01L23/373;H05K1/05;(IPC1-7):H01L23/14;H01L23/36 主分类号 H01L23/15
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