发明名称 LEAD FRAME
摘要 PURPOSE:To inhibit warp, curing, and undulation after resin molding so that transfer and positioning can be accurately carried out, by a method wherein a pair of slits are formed alternately from inner and outer rims at a suitable point of a band plate section in the oblique direction to its longitudinal direction. CONSTITUTION:At the middle point between resin-molded parts 3, 3 disposed in an array at fixed pitches, slits 6, 6 are cut alternately from the inner and outer rims of the band plate section 1 in an oblique manner to the longitudinal direction. The place and number of slits 6 are suitably selected according to the degree or distribution of the thermal shrinkage of the part 3. The band plate section 1 receives compression stress in the longitudinal direction with the thermal shrinkage accompanying the cooling after resin molding; however, this stress is absorbed by the deformation of the slits 6, and so deformation, warp, curving, and undulation do not generate. Although the band plate section 1 receives tensile force in the longitudinal direction during the transfer of lead frames having element main bodies, the lead frames do not elongate unexpectedly because the tensile force branches into the component in the depth direction of the slit 6 and the component in the width direction.
申请公布号 JPS61104650(A) 申请公布日期 1986.05.22
申请号 JP19840227182 申请日期 1984.10.29
申请人 ROHM CO LTD 发明人 TSUMORI MASAHIKO
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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