| 摘要 |
A process for fabricating high performance backside illuminated detectors (10) is described. The process uses a transmissive adhesive (12) such as epoxy on a transmissive substrate (10) to hold the detector material (14) during the fabrication process. After fabrication and connection to a readout device (20), such as a CCD, the substrate (10) and adhesive (12) are removed using an appropriate solvent, leaving the thin detector assembly (14, 16), without extraneous material, mounted directly on the CCD (20). The process may be used for a variety of detector materials. |
