METHOD OF BONDING SEMICONDUCTOR DEVICE,申请号JP19840203166-传众专利搜索

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发明名称	METHOD OF BONDING SEMICONDUCTOR DEVICE
摘要
申请公布号	JPS6181694(A)	申请公布日期	1986.04.25
申请号	JP19840203166	申请日期	1984.09.28
申请人	NEC CORP	发明人	WATABE YOSHIMICHI
分类号	H01L21/60;H05K3/32	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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