| 摘要 |
PURPOSE:To contrive to improve the yield by preventing stress to a semiconductor chip without increasing the number of processes, and preventing wire disconnection by a method wherein at least the electrode surface of a semiconductor chip is coated with rubber series resin and sealed with hard epoxy resin. CONSTITUTION:A LED chip 1 of GaAs is bonded to an end surface of a lead frame 2 by face-up, and then an end surface of a lead frame 3 is connected to the electrode of the chip 1 with a wire 4; next, the chip 1 is coated with a rubber series resin 5. For a coat of this rubber series resin, it is diluted with e.g. a dilution before coating. On drying, the dilution evaporates and a thin film of several mum-10 and several mum made of rubber series resin is formed. The thin film can be formed of cource by dipping, too. Packaging with a hard epoxy resin 6 is carried out after these processes. |
