发明名称 PROCESS FOR ETCHING POLYSILICON WITH FREON 11 AND ANOTHER GAS
摘要 A process for etching polysilicon wherein CFCl3 (Freon 11) and another gas, typically SF6, is pre-mixed in a storage chamber (1) before routing to an etching chamber (5). This process prevents condensation of the Freon 11 in a routing line and resultant failure of a mass flow controller (3) due to liquid ingestion. Furthermore, since the gases are pre-mixed and only one mass flow controller is used, the accuracy of the mixture is not dependent on the precision of the mass flow controller.
申请公布号 WO8602199(A1) 申请公布日期 1986.04.10
申请号 WO1985US01609 申请日期 1985.08.26
申请人 TEGAL CORPORATION 发明人 SCANNELL, JACK, WAYNE
分类号 H01L21/302;H01L21/3065;H01L21/3213;(IPC1-7):H01L21/302;F17C7/00;F17D1/02;F17C5/06;H01L21/306 主分类号 H01L21/302
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