BACK PLANE

摘要

A back plane for use as a power bus which supports and electrically energizes microcircuit chips. The back plane is formed by a laminated structure in which are mounted wire wrap pins that form terminals for the microcircuits. The laminates are sheets of conductive material insulated from one another and the wrap pins are mounted in the laminated structure so that electrical contact for each pin is made with only one of the conductive laminates. There are sufficient wrap pins to provide electrical contact with each of the respective conductive laminates. The laminates also include channels in which microcircuit chips may be mounted. The leads from the chips can be wrapped around the terminal pins which are connected respectively to the laminates energized at appropriate voltage levels.