| 摘要 |
PURPOSE:To form the titled device very easily and economically by providing a fine lead having a metal ball at the end thereof on an electrode pad and thereafter separating a ball from the fine lead wire. CONSTITUTION:A metal ball 11 is formed at the end of a metal fine lead 9 with electric dischrge or hydrogen flame, etc. The ball 11 is then connected to an aperture of electrode terminal 4 on a semiconductor element 1 by a connecting means such as the thermal bonding method or ultrasonic wave method. The fine lead 9 is lifted while it is held by a holding plate 12 and the fine lead 9 is cut at the coupling part with the ball 11 by giving gas flow or air flow to pull the fine lead 9. Thereby, a desired bump 8 can be formed. |
