| 发明名称 |
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| 摘要 |
Method and apparatus for mounting a semiconductor device in a housing, which includes first providing a metallization on a part of the surface of the semiconductor body of the semiconductor device to be connected to the housing, subsequently permanently connecting the semiconductor body to a part of the housing being in the form of a substrate with an organic adhesive to which metal particles have been added, and connecting electrodes of the semiconductor device to terminals disposed in the housing. |
| 申请公布号 |
DE3001613(C2) |
申请公布日期 |
1986.04.03 |
| 申请号 |
DE19803001613 |
申请日期 |
1980.01.17 |
| 申请人 |
SIEMENS AG, 1000 BERLIN UND 8000 MUENCHEN, DE |
发明人 |
EXNER, KLAUS DIETER, 8025 UNTERHACHING, DE |
| 分类号 |
H01L21/52;H01L21/60;H01L23/482;(IPC1-7):H01L21/52;H01L21/58;H01L21/98 |
主分类号 |
H01L21/52 |
| 代理机构 |
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