发明名称 HEATSINK FOR INTEGRATED CIRCUIT DEVICE
摘要 A heatsink (10) for a semiconductor device (30), such as an integrated circuit, and particularly a device of the so-called single-in-line type, has a recess (14) in its lower edge to receive the generally rectangular casing (33) of the device (30) and an area (24) extending from the base of the recess for heat-conductive engagement with a metal tab (34) extending from one long side of the device. A lug (40) projects from a side edge of the recess to enter a notch (38) at one end of the casing that is provided as an index for identifying the pin numbering of the device. The lug (40) obstructs an attempt to mount the device in reverse orientation in the recess.
申请公布号 DE3173844(D1) 申请公布日期 1986.03.27
申请号 DE19813173844 申请日期 1981.11.24
申请人 COLUMBIA-STAVER LIMITED 发明人 SMITH, ANTHONY
分类号 H01L23/40;(IPC1-7):H01L23/36 主分类号 H01L23/40
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