Method of soldering using magnetopropulsion

摘要

The invention relates to the soldering of electronic components. The transient magnetic field provided by the coil 7 acts on the molten solder bath 8 in order to induce therein movement towards the mask 11 provided with openings 12. The force of acceleration of this movement is such that a portion of the bath 8 is projected beyond the mask 11 via its openings 12 towards the target areas forming the zones to be soldered. The invention finds application in the mass-soldering of electronic-component boards. <IMAGE>