| 摘要 |
PURPOSE:To enable high-packing density superconductive integrated circuits to be wired to each other, by forming independent superconductive integrated circuits on the same substrate, and effecting connection between these integrated circuits by means of superconductive film wirings formed on the substrate. CONSTITUTION:Wirings 2, 3 are arrayed in a lattice by employing one or two superconductive layers which are the same as those used in the integrated circuits. In the case of two or more layers, the wirings are insulated from each other through an interlayer insulating film 10. As a material for the superconductive wiring, Nb or a superconductive material which contains Nb as a principal component, such as Nb3Sn, may be employed. At the intersections in the lattice wiring array, the wirings 2, 3, which need to be connected to each other, are connected by an alloy film 4 containing Pb as a principal components. In the case where the wirings 2, 3 are connected at two positions at an intersection, a Pb alloy 9 as a first layer is first formed to connect the wirings 3, and the interlayer insulating film 10 is formed, and then, a Pb alloy film 11 as a second layer is formed. |
