| 摘要 |
PURPOSE:To improve the moldability by making the melting viscosity of the resin sealing material suitable by a method wherein the distribution of grain sizes of the filler contained in the resin sealing material is made specific. CONSTITUTION:A portion with a grain size of 2mum or less of the filler 7 contained in the resin sealing material 5 in a resin-sealed type semiconductor device is reduced to 3% or less in accumulative content. For example, a sealing member 5 constituting the sealing package is made of epoxy resin, and only a required amount of the filler 7 composed of melt silica powder or crystal silica is contained therein in order to improve the mechanical strength or the coefficient of thermal expansion or for other purposes. The grain size of this filler 7 is brought into a distribution of grain size as above-mentioned. This manner can prevent the decrease in moldability and the generation of wire bending under an increase in melting viscosity of the sealing member 5 more than necessary. |
