发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To enable to regenerate the pellet which was once rejected as a defective product by a method wherein auxiliary bonding pads, which are electrically connected to bonding pads, are provided. CONSTITUTION:The points of cutting may be selected on the ordinary bonding pads 2a and 12a or on the branch wiring parts 2a' and 12a'. However, after a laser mark is affixed, the product once decided as a defective may sometimes be reproduced and used as a non-defective by changing the specification and the like for reinspection or retesting and the like in the state of pellet. At this time, the auxiliary bonding pads 2b and 12b and the branched wiring parts 2b' and 12b' are not cut at all. Accordingly, the reproduction of defective pellets can be possible by using a wiring path coming from said branched wiring parts to the main wiring parts. Besides, if the bonding pad e1uipped with an auxiliary bonding pad is selected to the bonding pad for power source line, inspection period can be reduced when inspection is performed after the probe inspection.</p>
申请公布号 JPS615539(A) 申请公布日期 1986.01.11
申请号 JP19840125182 申请日期 1984.06.20
申请人 HITACHI SEISAKUSHO KK 发明人 SAKIMOTO MASAKAZU
分类号 H01L21/66;H01L23/544;(IPC1-7):H01L21/66 主分类号 H01L21/66
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