| 发明名称 |
TAPE-AUTOMATED-BONDING OF INTEGRATED CIRCUITS |
| 摘要 |
<p>A tape for use in tape-automated-bonding of integrated circuits comprises series of interconnection arrays arranged along the tape, each array being formed by a number of interconnection beams. A terminal is located on each beam for bonding to a respective interconnection pad of an integrated circuit. The terminals of the tape comprise a conductive material having a Vickers hardness number of 55 or less, and thus have a compliance which facilitates even bonding. The invention includes a method of producing the tape.</p> |
| 申请公布号 |
CA1198833(A) |
申请公布日期 |
1985.12.31 |
| 申请号 |
CA19820406703 |
申请日期 |
1982.07.06 |
| 申请人 |
BRITISH TELECOMMUNICATIONS PUBLIC LIMITED COMPANY |
发明人 |
SINNADURAI, FRANCIS N.;SMALL, DAVID J.;BLAIN, ALEXANDER A.;COOPER, KENNETH |
| 分类号 |
H01L21/48;H01L21/60;H01L23/495;H05K3/40;(IPC1-7):H01L21/82 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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