| 摘要 |
PURPOSE:To expand the real effective area by folding a lead terminal to the back side along a side face of a mold forming and fitting the lead to the surface of a multi-layer printed wiring board so as to increase the mounting density. CONSTITUTION:A lead electrode is formed to a glass epoxy substrate of resistance to high temperature, a surface wave filter element 3 is adhered to the center of the board 1 and an Au wire connects a pad electrode and the lead electrode of the element 3. Then a wire bonding part comprising the element 3 and the Au wire is covered by a cap 5 having a recessed part at the center and the result is adhered to the board 1. Then a lead terminal 6 subjected to solder dip plating is soldered to the lead electrode, the entire part is formed and molded by a resin 7 while leaving a part of the terminal 6 and the terminal 6 is folded to the back side along the side face of the forming mold. |
