| 摘要 |
PURPOSE:To eliminate the delamination of a copper circuit pattern, by connecting constantan lead wires between a plurality of copper circuit patterns formed to a ceramic or saphire substrate having high heat conductivity at predetermined positions in series. CONSTITUTION:For example, molybdenum or tungsten is applied to the surface of a substrate, which comprises oxide or non-oxide type ceramic or saphire having a thickness of 0.2-0.35mm. and high heat conductivity, and baked in a reducing atmosphere to apply a metallization treatment to said substrate 1 and electroless plating of Ni is applied onto the metallized layer. Further, a copper circuit board punched in a predetermined shape is connected to the plating layer by a silver soldering method to form copper circuit patterns 2. Then, constantan wires 3 with a diameter of about 50mum are soldered between the corresponding terminals of the patterns 2 to constitute a series circuit and lead wires 5 and connected while thermoelectromotive force and a galvanometer are connected between both terminals A, B. |
