发明名称 FORMATION OF MULTI-LAYERED WIRING
摘要 PURPOSE:To provide a stable contact which can afford easy fine formation by, after forming a first wire, decomposing a metallic compound in the position of contact with the use of light effective to decompose and separate the metallic compound so as to form a metal projection in the position of the contact. CONSTITUTION:A substrate 1 provided with predetermined elements is applied with light (for Al, lambda=257.2mm.) through a mask in a vacuum container under a pressure of 10<-2>-10<-3>torr while a metallic compound gas [e.g. Al2(CH3)6] is introduced so as to form a wire 2. After that, the mask is substituted and a metal projection 5 is formed under the same conditions. A flat interlayer insulation film 3 is formed to cover them and then the whole surface thereof is etched such that the metal projection 5 in the contact is projected over the interlayer insulation film 3 by 1,000-3,000Angstrom . A second wire 4 is then formed in a similar manner with the first wire so as to cover the projection 5. Thus, a multi-layer wire which is connected with low contact resistance and can be worked finely is be formed with high yield.
申请公布号 JPS60235440(A) 申请公布日期 1985.11.22
申请号 JP19840092274 申请日期 1984.05.08
申请人 MATSUSHITA DENKI SANGYO KK 发明人 IWAMOTO NORIKO;TAKEYAMA KENICHI
分类号 H01L23/522;H01L21/768;(IPC1-7):H01L21/88 主分类号 H01L23/522
代理机构 代理人
主权项
地址