| 发明名称 |
SOLE IN-LINE TYPE INTEGRATED ELECTRONIC PART AND METHOD OF PRODUCING SAME |
| 摘要 |
An insulating package premolded on a metallic frame with electrical contacts contains in an inner space a semiconductor chip which rests on a thermic dissipator and is connected to the electrical contacts. The inner space of the package is closed on top by a cover provided with a lateral extension with a bent end, which operates not only as a cover, but also as a means for fastening and thrusting the package toward a support surface. |
| 申请公布号 |
JPS60233841(A) |
申请公布日期 |
1985.11.20 |
| 申请号 |
JP19850025339 |
申请日期 |
1985.02.14 |
| 申请人 |
ESU JII ESU ATESU KONPONENCHI ERETSUTORONISHI SPA |
发明人 |
JIUSETSUPE MARUCHIISHI;KARURO KOGUNETSUCHI DE MARUTEIISU |
| 分类号 |
H01L23/04;H01L21/02;H01L21/683;H01L23/02;H01L23/047;H01L23/367;H01L23/40;H01L23/50 |
主分类号 |
H01L23/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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