| 摘要 |
PURPOSE:To obtain superior close adhesion, superior operation efficiency, and high sensitivity as a resist material by incorporating a specified ethylenically unsatd. compd., an org. halogenated compd., a film-forming polymer, and a sensitizer. CONSTITUTION:The resist material contains ethylenically unsatd. polymers represented by formulae I and II, the org. halogenated compd., the film forming polymer, and the sensitizer or a sensitizer system capable of releasing free radicals upon exposure to actinic rays. In formula I, R<1>, R<2> is H or methyl; m is an integer of 1 or 2; (a), (b) are an integer and a+b=6, and may be 0. In formula II, Z is phenyl or a substd. phenyl; R<1> is 1-3C alkylene; R<2> is H or methyl; R<3> is H, methyl, ethyl, CH2C, or CH2Br. Each of the compds. of formulae I and IIis used in an amt. of 10-45wt% to the film-forming polymer. It is preferable to use a combination of an ester formed by acrylic acid and a condensation product of 2,2,2',2'-tetraquis(hydroxymethyl)-3,3'-oxydipropanol and 6-hexanolide, as the compd. of formula I ; and gamma-chloro-beta-hydroxypropyl-beta'-methacryloyloxyethyl-o-phthalate, as the compd. of formula II, and to use a compd. having -CBr3 as the org. halogenated compd. |
