| 摘要 |
PURPOSE:To reduce thermal noises efficiently and to obtain high speed, by providing a metal layer, which is formed on the active region of an element through an insulating film, p type and n type semiconductor layers, which are formed on the metal layer, a metal layer formed on the semiconductor layers, and a circuit for cooling the active region, which connects said layers. CONSTITUTION:Thermal noises are mainly generated in an emitter region 3 and a base region 2. Therefore, only these regions are selectively cooled. For example, when a current is made to flow in the direction of an arrow in a circuit utilizing a Peltier effect as shown in the Figure, the interface between an n type semiconductor layer 10B and an Au layer 9 and between a p type semiconductor layer 10A and the Au layer 9 is cooled. As a result the emitter region 3 and the base region 2 are cooled. When the interface between the p and n type semiconductor layer 10A and 10B and the Au layer 9 are cooled, the upper parts of the semiconductors are heated. Since electrodes 11 also serve the role of heat radiating plates, the heat is radiated efficiently. When the element shown by the Figure is packed, the heat generated in the semiconductor can be radiated by providing a radiating means in the package. |
