发明名称 CHUCKING APPARATUS OF SEMICONDUCTOR SUBSTRATE TRANSFER MCEHANISM
摘要 PURPOSE:To permit a pair of arms to be held and transferred without being attached onto the front and back surfaces of a substrate by installing a pair of arms which can be interval-adjusted and are equipped with chucks in stairs form which are upwardly tapered at each top edge, onto the both sides of a transfer base, and guiding a pair of arms by a guide shaft. CONSTITUTION:When a 6' semiconductor substrate 7a is to be chucked, arms 3a and 3b are opened by extending a pair of cylinders 4a and 4b, and chuck members 6a and 6b are separated oppositely, and the substrate 7a is positioned onto the horizontal planes in stairs form 6a-1 and 6b-1, and then the back surface of the substrate 7a does not contact with the chuck members 6a and 6b, and the lower edge of the outer periphery line-contacts with the horizontal planes 6a-1 and 6b-1. Then, the cylinders 4a and 4b are contracted to pull the arms 3a and 3b to a transfer base 2, and the cylinder 4a looses the contraction force in the vicinity of the contraction stroke end, and the arm 3a is pulled close to the transfer base 2 by the urging force of a pulling spring 5a. Therefore, the vertical surfaces of the stepped part of the chuck member 6a can be held freely from the contact with the front and back surfaces, preventing the substrate 7a from being strained by the spring force.
申请公布号 JPS60207740(A) 申请公布日期 1985.10.19
申请号 JP19840060836 申请日期 1984.03.30
申请人 HITACHI DENSHI ENGINEERING KK 发明人 NAKA TAKAYUKI;HARAGUCHI TATSUHITO;USHIJIMA YOSHISADA
分类号 B23Q3/06;B23Q7/04;B25J15/08;H01L21/67;H01L21/68;H01L21/683 主分类号 B23Q3/06
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