HEAT SINK FOR SEMI-CONDUCTOR DEVICES

摘要

A heat sink has an integral island portion 12 which has a mounting face 13 for heat transfer contact with the sole plate of a semi-conductor device case and clearance bores 16, 17 to receive the terminal pins of the semiconductor device. Grooves 19, 20 in the face 13 provide passages under the sole plate for wires connected to the terminal pins. Alternatively, cross passages within the island portion communicating with the clearance bores may be employed for this purpose.