| 摘要 |
<p>PURPOSE:To enable to regenerate the parts to be mounted on the substrate and to contrive to conserve the manhour and the materials by a method wherein the hybrid integrated circuit is actuated by making probes to contact to a circuit element or the circuit substrate in a stage that the circuit element has been mounted on the circuit substrate and a trimming is carried out. CONSTITUTION:Thin film or thick film circuits 2 are formed on a ceramic substrate 1 and an active element 4 is adhered on the substrate 1 using a bonding agent. Probes 7 are erected in all the positions 12 of the probes, and moreover, the probes are mutually connected so that a passive element 3 can be simply exchanged between the probes, the whole circuit is formed and a resistor 8 is functionally trimmed by actuating the circuit. meanwhile, the substrate 1, whereon the circuits 2 have been formed, is adhered on a metallic base ribbon 11 and the element 4 is further adhered on the substrate 1. Probes are erected in all the positions 12 of the probes, and moreover, the probes are mutually connected so that the element 3 can be simply exchanged between the probes, the whole circuit is formed and the resistor 8 is functionally trimmed by actuating the circuit. According to this method, the reduction of the manhour and the materials can be contrived because the number of parts to be mounted on the substrate can be made minimum and the regeneration of the parts is made possible.</p> |
