发明名称 PHOTORESIST COMPOSITION
摘要 PURPOSE:To improve adhesion to a substrate and to enable a micropattern to be formed by incorporating a specified amt. of bisazide compd. in the reaction product of an epoxy compd. with an active hydrogen compd. contg. an unsatd. group. CONSTITUTION:A bisazide compd. amounting to 0.5-50pts.wt. is incorporated in 100pts.wt. of the reaction product of an epoxy compd. with an active hydrogen compd. contg. an unsatd. group, such as methacrylic acid, in an epoxy equiv. to active hydrogen equiv. ratio of 0.5-2.0. Such a photoresist compsn. has high resolution, high sensitivity, high contrast, and high film retentivity, and superior adhesion to a substrate. As a result, a resist having a superior resist pattern can be obtained and it can be used for manufacture of LSI, VLSI, and other electronic parts in relation to semiconductors.
申请公布号 JPS60181741(A) 申请公布日期 1985.09.17
申请号 JP19840038310 申请日期 1984.02.28
申请人 MITSUBISHI DENKI KK 发明人 MASUI KATSUE;KUBOTA SHIGERU;MORIWAKI NORIMOTO;ETOU SHIYOUHEI
分类号 G03F7/008;C08G59/00;C08G59/44;G03F7/012;G03F7/027;G03F7/038 主分类号 G03F7/008
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