发明名称 FORMATION OF ELECTRODE LEAD
摘要 <p>PURPOSE:To prevent deformation and cracks generating when a resistance welding is performed by a method wherein at least the bottom face and the side face of a chip are brought to come in contact with a power supply electrode to be used for a resistance welding in a supported manner, and a resistance welding is performed under the above-mentioned state. CONSTITUTION:An electrode chip 2 is arranged on a power supply electrode substrate 1, and the electrode chip 2 is supported by contacting a side power supply member 3 having the face covering almost entire side face is contacted to the side face of said electrode chip 2, thereby enabling to supply power to the electrode chip 2 through the side face of the electrode chip 2. When a lead wire 4 is going to be welded on the electrode chip 2, the lead wire 4 positioned on the upper part of the electrode chip 2 is lowered, its tip is pressure-welded (as shown by arrow in the diagram) at the prescribed position located on the electrode chip 2, power is applied from a power source 6 simultaneously, and the electrode 2 and the lead wire 4 are heated up. The welded area is made larger by widening the tip of the lead wire 4, and this is helpful in the improvement of welding strength.</p>
申请公布号 JPS60182153(A) 申请公布日期 1985.09.17
申请号 JP19840037725 申请日期 1984.02.28
申请人 HITACHI DENSEN KK 发明人 YOSHIDA HIROMICHI;KAYANE KOUICHI;OOTAKE HIROO;SANKI SADAHIKO;TAMURA KOUICHI
分类号 H01L23/48;H01L21/48 主分类号 H01L23/48
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