| 摘要 |
PURPOSE:To enable to improve a solder wettability and to eliminate the unevenness of a solder layer between the substrate and each element when the elements are soldered on the substrate, whereon the semiconductor elements have been arranged, by a method wherein either of jigs, the semiconductor elements or the substrate is made to revolve. CONSTITUTION:Jigs 2 are respectively positioned on the substrate 3, whereon semiconductor elements 1 have been put, solders 4 are respectively inserted between the elements 1 and the substrate 3. The substrate 3 is heated, the solders 4 are melted, and when each jig 2 is made to revolve using the center axis of each element 1 as a rotating shaft, the melted solder spreads all over the whole contact face of each element 1 and the substrate 3. According to this way, the solder wettability is improved and the unevenness of the solder layer between the substrate 3 and each element 1 is also eliminated. As a result, a soldering of the substrate 3 and the semiconductor elements 1 becomes secure. Even though the substrate itself or the elements themselves is or are made to revolve, the similar effect is obtained. |
