| 摘要 |
PURPOSE:To facilitate bonding work, and to obtain stable characteristics by a method wherein the titled electrodes are provided with a wire guide groove to make uniform the length of a plurality of bonding wires, and with a plurality of U-shaped wire guide grooves to equalize the intervals of the wires. CONSTITUTION:In the case of the wire bonding between semiconductor capacitors 33, and to a transistor 42 which are arranged on a substrate 41, first the wires 43 are bonded to the fixed electrode 42-1 of the transistor 42, and next the wire leads are passed through the wire guide groove 32-2 to equalize the wire intervals of the capacitors 33, while being viewed through a microscope; further, they are put to wire bonding by taking aim at the wire guide groove 32-1 to make uniform the wire lengths. Besides, the semiconductor capacitors 33 are subjected to wire bonding in the same manner. |
