| 摘要 |
PURPOSE:To prevent a wafer or the like made of GaAs from causing on its ground surface a coarse and tearing phenomenon, by mounting the semiconductor wafer so that its crystal azimuth may be placed in the predetermined direction of a holding table and arranging a grinding wheel with its grinding direction in a predetermined relation to the crystal azimuth. CONSTITUTION:A semiconductor wafer W, when it is mounted onto a holding table 12 in a mounting section 30, is arranged so that a crystal azimuth of the wafer W may be placed in the predetermined direction with respect to the holding table 12 by restricting an angular position of the wafer W in relation to its crystal azimuth. In this way, a relative position between the crystal azimuth of the wafer W and its grinding direction can be specifically determined as required by substantially equalizing the grinding direction of a surface of the wafer W by each of grinding wheel assembly structures 4A-4C. And the angular position of the wafer W in relation to its crystal azimuth can be easily restricted to a specific position by mounting the wafer W in its deformed part, that is, flat part being as a reference. In such way, as a result after grinding a surface of ten sheets of wafers made of GaAs, the wafer, being ground to surface roughness of about 0.2mum, has never caused a tearing phenomenon on the ground surface. |
