| 摘要 |
PURPOSE:To reduce the rate of an area occupied by a wiring in a pellet and to reduce wiring resistance by arranging plural pads of same potential, more preferably in the relative position from the center of the pellet. CONSTITUTION:Two electrode pads 40 and 31 connected to the same source potential or earth potential are arranged on a semiconducltor pellet 10. The pellet 10 is attached to an assembly case substrate 20 and the electrode pad 40 is connected to an external lead 30 through a metallic thin wire 50. The electrode pad 41 is connected to the assembly case substrate 20 by a metallic thin wire 51 and the substrate 20 is connected to the external lead 30 by a connection part 60. Accordingly, the electrode pads 40 and 41 can be connected with the adjacent circuit elements respectively thereby shortening each wiring and reducing a width of wiring. |
