| 摘要 |
<p>PURPOSE:To prevent scraps generated during a dicing process from sticking to a semiconductor chip by a method wherein an adhesive protecting sheet is applied to the surface of a semiconductor wafer and dicing is accomplished from above said protecting sheet. CONSTITUTION:The rear surface 11b of a semiconductor wafer 11 is applied to an adhesive dicing sheet 12. Next, to the upper surface 11a of the wafer 11, an adhesive protecting sheet 13, which is a vinyl chloride sheet with a side thereof coated with an adhesive agent, is applied. A process follows wherein the wafer 11 is segmented into chips 11' from the side of the protecting sheet 13. The protecting sheet 13 is peeled off the dicing sheet 12 and then installed on a mounting agent 15, to be bonded to a package 14. Baking is accomplished for the hardening of the mounting agent 15, whereafter the protecting sheet 13 is peeled off the chips 11'.</p> |
