发明名称 ELECTROLESS PLATING DEVICE FOR POWDER AND GRANULAR MATERIAL
摘要 PURPOSE:To permit easy control of reaction time and to enable extra-thin plating by communicating the bottom of a plating cell constituted of a filter body with a suction means via a cock. CONSTITUTION:A plating cell 10 is placed on a filter device 20 and the bottom thereof is formed of a filter medium 24 in the upper part of a funnel-shaped body 25. A three-way cock 30 is mounted to the top end of the leg part of the body 25 and while the cock is held closed, the medium 24 holds thoroughly the plating liquid. The other two ports which are not communicated with the funnel leg part of the cock 30 are communicated respectively to a washing water reservoir 50 and a plating liquid reservoir 60 by conduits, which reservoirs 50, 60 are connected by suction bottles to suction means. Then when the cock 30 is opened after plating in the cell 10, the plating liquid is discharged quickly and the quick sepn. of the plated powder and granular material and the plating liquid is made possible. The reaction time is thus terminated in short time and the formation of the extra-thin plating is possible as well.
申请公布号 JPS60141872(A) 申请公布日期 1985.07.26
申请号 JP19830245409 申请日期 1983.12.28
申请人 MITSUBISHI KINZOKU KK 发明人 TAKAHASHI TSUTOMU;TODA KAZUO;ADACHI KAZUYOSHI
分类号 C01B31/36;C01B21/064;C23C18/16;C23C18/31 主分类号 C01B31/36
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