| 摘要 |
<p>PURPOSE:To facilitate the positioning of leads, metallic projections, and element electrodes at the time of transcribing semiconductor elements by the transcription bump system by a method wherein the width of a film lead in the region for the transcription of a metallic projection and corresponding to the electrode of the semiconductor element is made smaller than that in the other region. CONSTITUTION:In projecting a plurality of film leads 3 out of a resin film 1 while being made parallel at fixed intervals, the width A of the root of these leads 3 is made larger, and the width B of the tip 11 smaller. The length C of the tip 11 is made to correspond to the length at least of a side of the semiconductor element electrode, and made as the length corresponding to the length D of the metal projection 13 in the direction of extension of the lead 3. Such transcription of the metal projection 13 of the element onto the tip 11 facilitates element positioning and increases the junction strength.</p> |
