Process for forming elongated solder connections between a semiconductor device and a supporting substrate.

摘要

A process for forming elongated solder terminals (38) to connect a plurality of pads (21) on a semiconductor device (20) to a corresponding plurality of pads (12) on a supporting substrate (10) by,
forming a means (32, 42) to maintain a predetermined vertical spacing between the semiconductor (20) and the supporting substrate (10) outside area of the pads,forming and fixing solder extenders (16) to each of the solder wettable pads on the substrate or the device to be joined,positioning the semiconductor device provided with solder mounds (22) on the solder mountable pads (21) over the supporting substrate with the solder mounds in registry with the pads (12) on the substrate with the solder extenders (16) positioned therebetween, the means to maintain vertical spacing located between and in abutting relation to the device and substrate, andheating the resulting assembly to reflow the solder mounds and the solder extenders while maintaining a predetermined spacing thus forming a plurality of hour-glass shaped elongated connections (38).