| 摘要 |
PURPOSE:To obtain a small-size compact head by a method in which a supporter having a heating element and a supporter having IC portion are faced to each other, and a signal electrode wire to the heating element and an output wire from the IC portion are bonded with each other in the contact region. CONSTITUTION:In a head 20, on a common base 1, a resistor plate 3 having a heating element 2 and a printed wafer 5 fixed with many IC chips 4 are fixed in mutually facing manner. In short, a signal electrode wire 10 and an output wire 12 are each extended to contact portion 6 between the plate 3 and the wafer 5 and coated with solder pastes 14 and 15, and both the plate 3 and the wafer 5 are butted and integrally bonded with each other through the melted solder layer 6 on the base 1. Since the interval between the plate 3 and the wafer 5 can be minimized as much as possible, the occupying area on the base 1 can be reduced, and small-size compact head structure can be attained. |
