| 摘要 |
<p>PURPOSE:To improve the heat resistance and reliability at high temperature and himidity of solder by a method wherein a resin product containing a compound with at least a cyclic furan and a multi-functional epoxy compound is utilized for sealing process. CONSTITUTION:A compound A with cyclic furan such as furan denatured phenol resin includes all synthetic resins with cyclic furan, e.g. furfuryl alcohol, furfural cocondensate resin, furfural alalkyl phenol cocondensate resin etc. As for a multiple functional epoxy compound B, e.g. diglycylglyl ether of bisphenol A, triglycylglyl ether of paraminophenol are utilized. The allowable blending ratio between the compounds A and B may be within the range of 0.5-9.0wt% of B to 1wt% of A. As for the accelerating catalyst for hardening reaction of a product, amine group such as triethanol amine etc. are applicable. A resin product may be prepared by means of heating and kneading each component.</p> |
