| 摘要 |
PURPOSE:To produce multiple pin resin sealed semiconductor device subject to easy installation with less lead bending by a method wherein the external leads bent inward along the resin main body and the other external leads bent outward and stepwise are alternately arranged. CONSTITUTION:External lead 3a bent outward and stepwise outside a resin main body 1 and the other external leads 3b bent inward along the resin main body 1 are alternately arranged at the side of the resin main body 1. The bottom points of the leads 3b and 3a are made flush to make installation of wiring pads 12, 13 for contact on a print wiring substrate 11 easier. The outside wiring pads 12 and the inside wiring pads 13 are also alternately arranged so that the pad width size may be designed wider requiring less precision of the wiring pattern as well as less precision of locating semiconductor device on the substrate 11 in case of installation. |
