发明名称 METHOD FOR WET-PLATING POLYAMIDOIMIDE
摘要 PURPOSE:To form a plated layer causing no stripping under shear even at high temp. on polyamidoimide by roughening and degreasing the surface of the polyamidoimide, etching it with a mixed aqueous soln. contg. Na2Cr2O7 and H2SO4, and carrying out chemical plating combined with electroplating. CONSTITUTION:The surface of a molded article of polyamidoimide contg. optionally a filled inorg. material is roughened with sand paper or the like and degreased after after-cure in a heat treatment stage. The degreased surface is optionally pre-etched with acetone, glacial acetic acid, dioxane or carbon tetrachloride, and it is etched with a mixed aqueous soln. contg. Na2Cr2O7 or K2Cr2O7 and H2SO4. H3PO4 may be further added to the soln. Wet plating is then carried out by chemical plating combined with electroplating to form a plated layer causing no stripping under shear even at high temp. Stripping under shear is caused by the difference in thermal expansion between the plated layer and the base material.
申请公布号 JPS6082674(A) 申请公布日期 1985.05.10
申请号 JP19830191580 申请日期 1983.10.13
申请人 MITSUBISHI KASEI KOGYO KK 发明人 YAMAGUCHI SHIYOUZABUROU;SEKIGUCHI ISAMU
分类号 C23C18/24;C23C18/22;C23C28/00 主分类号 C23C18/24
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