| 摘要 |
PURPOSE:To utilize excessive external lead-out leads when electrode pads of the element are increased in a single-inline-package-type semiconductor device, by providing external lead-out leads opposed to and spaced from an element carrying member of the lead frame with a space without direct connection therebetween, while the carrying member being supported only by the holding leads from a tie bar. CONSTITUTION:A multiplicity of external lead-out leads 3 are protruded from a tie-bar 4 constituting a lead frame and an element carrying member 2 is formed at the ends of the leads. In such a constitution, the carrying member 2 is usually held by connecting the external lead-out leads 3 thereto. In the present case, however, the carrying member is not connected to the leads, but held only by holding leads 8 protruded from the tie-bar 4. A semiconductor chip 1 is fixed on the carrying member thus held and connected to the leads through bonding wires 5. In such a manner, a circuit can be completed by utilizing excessive leads 3 when pads of the chip 1 are increased. |
