| 摘要 |
PURPOSE:To easily contain a carrier having good heat dissipation when an IC is fixed to the central portion of a ceramic chip carrier to form a semiconductor device, by providing piers having good heat conductivity in the IC chip carrying section and by providing a metallizing layer on the lower face thereof to be connected to the external cooling means. CONSTITUTION:When a semiconductor chip 3 is fixed on the central surface of a ceramic substrate 1, a multiplicity of piers having a high heat flow density and a low thermal resistance are implanted vertically, while being disposed parallel to one another. A metallizing layer 15 is adhered to the lower faces of these piers for covering the same, and a cooling core 10 having cooling fins 11 is fixed to the layer 15. After a chip 3 is fixed on the carrying section in a cavity 2, the electrode wirings of the chip 3 are connected to the pads 4, external terminals 5, connection terminals 6 or the like with the use of bonding wires 7 as usual, and the chip 3, the pad 4 and so on are covered with a cover 8. |
