PRETREATING METHOD FOR ELECTROLESS COPPER PLATING MULTILAYERPRINTED CIRCUIT BOARD,申请号JP19830153068-传众专利搜索

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发明名称	PRETREATING METHOD FOR ELECTROLESS COPPER PLATING MULTILAYERPRINTED CIRCUIT BOARD
摘要
申请公布号	JPS6046096(A)	申请公布日期	1985.03.12
申请号	JP19830153068	申请日期	1983.08.24
申请人	OKI DENKI KOGYO KK	发明人	TANAKA KAZUO
分类号	H05K3/42;C23C18/20	主分类号	H05K3/42
代理机构		代理人
主权项
地址

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